This website has a privacy policy to protect your personal information. Please click "I agree" to indicate your consent to this website's privacy policy. For more information, please click here.

Taiwan Semiconductor Research Institute

  • 繁體中文
  • A-
  • A
  • A+
搜尋
  • About Us
    • Mission and Vision
      Milestones
      Director General
      Location
  • Member
    • Services Overview
      Member Registration
      Member Profile
      • Edit Profile
      • Change Password
      • Forgot Password
      • Forgot Account
      FAQ
      Customer Consulting System
      Billing System
  • Chip Implementation
    • Chip Implementation
      • Service Descriptions
      • Tape-out Schedule
      • Tape-out Guidelines
      • Tape-out Application
      • Test Report
      • Total Credit
      • FAQ
      • Tape-out Approval
      • Full-price Packaging/Back-end Dicing
      • Contact
      • Price List
      Process/Silicon Intellectual Property(SIP)
      • Process/SIP Introduction
      • Process/SIP Application
      • Legal Literacy Advocacy Test
      • Technical Data Download
      • Online Assessment of Information Security
      • Service Lab
      PCB/IPD/Flip Chip Implementation
      • PCB Process/Schedule/Contact
      • PCB Software/Technical Data
      • PCB Price List
      • PCB Fabricaiton Application
      • PCB Post-application Operation
      • IPD Process Fabrication
      • Full-price Flip-chip Assembly Fabrication
      Others
      • Design File Export
  • Fabrication
    • Equipment List (Hsinchu)
      Equipment List (Tainan)
      Price List
      User Self-service
      OEM Service
      Contact
  • Measurement
    • Measurement Booking
      • Booking System
      • Price List
      • User Self-service
      • FAQ
      • Contact
      Materials Analysis
      • Materials Analysis Services
      • Integrated Materials Analysis Services
      • TAF 17025 Testing Laboratory
      • Equipment List
      • Price List
      • Advanced Consultation
  • Training
    • Introduction
      List of Courses
      Chip Design Course Registration
      Manufacturing Course Registration
      Occupational Safety Training
  • Technology Promotion
    • Advanced Fabrication Technologies
      Chip Design Innovation
      Patents
      Technology Transfer
      Advanced Talent Cultivation Project
      Industry-academia Collaboration Project
  • Collaboration
    • Promotion Strategies
  • Information
    • Headlines
      Activities
      News
      Public Opinion
      Venue Rental
      Equipment Status
      Guided Tours
      Recruitment
      Tender Notice
      Payment Inquiry
  • Search
  • 繁體中文
  • Sitemap
Chip Implementation
  • Chip Implementation
    • Service Descriptions
    • Tape-out Schedule
    • Tape-out Guidelines
    • Tape-out Application
    • Test Report
    • Total Credit
    • FAQ
    • Tape-out Approval
    • Full-price Packaging/Back-end Dicing
    • Contact
    • Price List
  • Process/Silicon Intellectual Property(SIP)
    • Process/SIP Introduction
    • Process/SIP Application
    • Legal Literacy Advocacy Test
    • Technical Data Download
    • Online Assessment of Information Security
    • Service Lab
  • PCB/IPD/Flip Chip Implementation
    • PCB Process/Schedule/Contact
    • PCB Software/Technical Data
    • PCB Price List
    • PCB Fabrication Application
    • PCB Post-application Operation
    • IPD Process Fabrication
    • Full-price Flip-chip Assembly Fabrication
  • Others
    • Design File Export
Home Chip ImplementationPCB/IPD/Flip Chip ImplementationPCB Price List
Print(Open New Window) facebook(Open New Window)

PCB Price List

PCB Fabrication Fee = Official Unit Price x Rate x PCB Unit Area No.

Official Unit Price

PCB Process Code PCB Fabrication Substance Unit Area (cm2) Unit Price (NTD / Unit Area)
PCB_2L FR4 2-Layer Board 5x5 563
PCB_4L FR4 4-Layer Board 5x5 938
PCB_2LHF16 RO 2-Layer High Frequency Board 4.75x5.2 2,063
PCB_4LMX RO-FR4 4-Layer Complex Board 4.75x5.2 2,625

Rate

Item Rate Relevant Documents
Industry and Research Community Official Price
Official Price x 100%
Terms and Conditions for  PCB Fabrication
Academia Full-price Discount 80% Official Price
Official Price x 80%
Academia Partial-price Discount 10% of Academia Full-price
Official Price x 80% x 10%
Other Requirements Consult PCB Contact

PCB Unit Area no.

1. Length / Width Definition
PCB Process Code PCB Fabrication Substance Unit Length (cm) Unit Width (cm) Maximum Length (cm) Maximum Width (cm)
PCB_2L FR4 2-Layer Board 5 5 30 20
PCB_4L FR4 4-Layer Board 5 5 30 20
PCB_2LHF16 RO 2-Layer High Frequency Board  4.75 5.2 28.5 20.8
PCB_4LMX RO-FR4 4-Layer Complex Board 4.75 5.2 28.5 20.8


2. Fabrication Dimension and Shape
  • BO Frame, ME Frame: Board Outline, Outer Frame. The Definitions and design rules, refer to:PCB Fabrication - Design Rules Manual.
  • Shape of ME Frame : Square or Rectangle
  • Fabrication Shape: Defined by BO Frame, can be Square, Rectangle, Polygon or Circle, … etc.
  • Payment Dimension: decided by ME frame. Length ≦ Maximum Length, and Width ≦ Maximum Width
Example: the following figures (ME Frame is red, and BO Frame is gray.)
Make size and shape

3. PCB Unit Area No. Formula
PCB Unit Area no.= ┌(ME Frame Length / Unit Length)┐ x ┌(ME Frame Width / Unit Width)┐
Before Multiplication, unconditional carry, the result is an integer.

Example: FR4 4-Layer application, the length and width of ME frame are 9cm and 6cm, then
PCB Unit Area No.=┌(9/5)┐*┌(6/5)┐ = unconditional carry = 2* 2 = 4


Available PCB Pieces

Available PCB pieces: For Academia Partial-price, there are 10 PCBs for each application .
Additional qauntity required: the applicant needs to pay full-price for extra PCBs.
  • NIAR
  • Facebook
  • YouTube
  • Customer Consulting System
  • Privacy and Security Policy



Customer Service:tsri-cs@niar.org.tw ext:7610
  • Hsinchu Base
    No.26, Prosperity Road I, Hsinchu Science Park, Hsinchu 300091, Taiwan, R.O.C.
    TEL. +886-3-5773693FAX. +886-3-5713403
  • Tainan Base
    No.25, Xiaodong Road, Tainan City 704017, Taiwan, R.O.C.
    TEL. +886-6-2090160FAX. +886-6-2086669
  • NCKU Chimei Office
    7F, Chimei Building, Tzu-Chiang Campus, No.1, University Road, Tainan City 701401, Taiwan, R.O.C.
    TEL. +886-6-2087971FAX. +886-6-2089122
Copyright © 2025 Taiwan Semiconductor Research Institute, NIAR. All rights reserved. Facebook YouTube