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Taiwan Semiconductor Research Institute

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Chip Implementation
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    • PCB Process/Schedule/Contact
    • PCB Software/Technical Data
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Home Chip ImplementationPCB/IPD/Flip Chip ImplementationPCB Fabricaiton Application
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PCB Fabricaiton Application

1. Membership Qualification
Verify that the applicant is a "certified" member of TSRI.


2. PCB Fabrication Application


Guidance manual:PCB Fabrication - Application Operation Manual
PCB Application Web Link


3. File Upload
Upload the files in the following table, before 23:59 pm of Application Deadline .
No. Document Name File Download
1 PCB Design e-file Word Application Form (for application, must upload) Download
pdf Example (for Reference, do not upload) Download
2 PCB Fabrication Review Form Word Application Form (for application, must upload) Download
3 Gerber Files
(including Drill Files)
RS-274X FR4 2-Layer Board 11 files * -
FR4 4-Layer Board 13 files *
RO 2-Layer High Frequency Board 11 files *
RO-FR4 4-Layer Complex Board 13 files *

* Layer Naming and Numbering: Refer to Item no. 1 "PCB Design e-file" of the above table.
* Each layout layer: Output each layout layer by Gerber format, and upload each file separately.


4. Data Verification and Submission
Verification: Verify that all uploaded PCB Application Form, PCB Design -file, and Gerber files are correct.
Submission: After verification and before Application Deadline, click "Submit" Button on Application web, and complete the application.


5. Others
After the Application Deadline:  No further updates or additional submissions of application materials will be accepted, to avoid affecting the rights of all applicants.
Incomplete applications: will not be processed.


6. Fabrication Application Flow Chart
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