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Equipment List (Hsinchu)

Notes：
  1. User Self-service or OEM Service：Please go to Manufacturing and Measurement Analysis Service System / MES system.
  2. Equipment Assessment Form: Please apply through Equipment Operation Training.
  3. Equipment Open Grade：Explanation.

Equipment of Lithography and Mask

No. Equipment Contact Ext. Introduction Technical Data Standard Procedures Precautions Operation Standards Assessment Guidelines Open Grade
C05 FEOL 6" WET BENCH Ms. Peng
Mr. Liu		 7714
7699		 C05-A C05-B C05-C C05-D C05-E C05-F B2
C06 BEOL 6" WET BENCH Mr. Liu
Ms. Peng		 7699
7714		 C06-A C06-B C06-C C06-D C06-E C06-F B2
C08 8" Chemical Mechanical Polishing System Ms. Lu
Mr. Liu		 7613
7699		 C08-A C08-B C08-C C08-D C08-E -- B4
C09 BEOL 8" WET BENCH Mr. Liu
Ms. Peng		 7699
7714		 C09-A C09-B C09-C C09-D C09-E C09-F B2
C10 FEOL 8" WET BENCH Ms. Peng
Mr. Liu		 7714
7699		 C10-A C10-B C10-C C10-D C10-E C10-F B2
C11 FEOL 8" Chemical Mechanical Polishing System Mr. Liu
Mr. Liu
7716
7699
 C11-A -- -- -- C11-E -- B4
L02A Photo Mask Production Service Ms. Hong 7746 -- -- -- L2A-D -- -- B4
L02W 6" Leica E-beam Direct Writing System Mr. Liu
Mr. Chiang		 7649
7579		 L2W-A L2W-B L2W-C L2W-D L2W-E L2W-F B3
L05 I-line Stepper Mr. Hsu
Mr. Huang		 7648
7567		 L05-A L05-B
L05C-B		 L05-C
L05C-C		 L05-D
L05C-D		 L05-E L05-F B2
L06 6" In-line SEM Mr. Liu 7649 L06-A L06-B -- L06-D L06-E L06-F B2
L09 6" Track Ms. Hong
Mr. Hong		 7746
7573		 L09-A L09-B L09-C L09-D L09-E L09-F B2
L13 6" FIB-dual Beam System Ms. Li
Ms. Chen		 7652
7575		 L13-A L13-B -- L13-D L13-E L13-F B4
L16 8" S9260A In-line SEM Mr. Liu 7649 L16-A L16-B -- L16-D L16-E L16-F B3
L17 8" Track System Mr. Huang
Mr. Hong		 7567
7573		 L17-A L17-B L17-C L17-D L17-E L17-F B2
L18 8 inch Focused Ion Beam System Ms. Chen
Ms. Li		 7575
7652		 L18-A L18-B -- L18-D L18-E L18-F B4
L19 Variable Shaped E-beam Lithography System Mr. Chiang
Mr. Cheng		 7579
7644		 L19-A L19-B L19-C L19-D L19-E L19-F B4
L20 Die-grade Pattern Definition Contact Alignment System Mr. Hong
Mr. Cheng		 7573
7644		 L20-A L20-B L20-C L20-D L20-E L20-F B2
L21 Mask Track Mr. Hong
Ms. Hong
7573
7746
 L21-A -- L21-C -- L21-E -- B4
L22 248-nm DUV Scanner Mr. Huang 7567 L22-A L22-B L22-C L22-D L22-E   B4
L24

Raith Voyager E-Beam Lithographic System

 Mr. Hsu 7648 L24_A L24_B   L24-D L24-E L24-F B2
M13 Stress Measurement System Ms. Lu 
Ms. Li		 7613
7652		 M13-A M13-B M13-C M13-D M13-E M13-F B2
M19 Metal 4 Point Probe Mr. Liu
Mr. Chiang		 7699
7579		 M19-A M19-B M19-C M19-D M19-E M19-F B2
M20 Thin Film Adhesion Testing System Mr. Liu
Ms. Peng		 7699
7714		 M20-A M20-B M20-C M20-D M20-E M20-F B1
M23 NK1500-thin Film Measurement System Ms. Liu
Ms. Lu		 7716
7613		 M23-A -- M23-C M23-D M23-E M23-F B2
M24 Surfscan Analyzer Ms. Peng
Mr. Liu		 7714
7699		 M24-A M24-B M24-C M24-D M24-E M24-F B2
M25 Ellipsometer M2000 Ms. Liu
Ms. Lu		 7716
7613		 M25-A M25-B -- M25-D M25-E M25-F B2
M28 White Light Interferometry Ms. Lu 7613 M28-A -- M28-C M28-D M28-E M28-F B3
R414 Chemical Laboratory Ms. Peng
Mr. Liu		 7714
7699		 -- -- -- R414-D -- R414-F B1



Equipment of Etch and Thin Film

No. Equipment Contact Ext. Introduction Technical Data Standard Procedures Precautions Operation Standards Assessment Guidelines Open Grade
E01 TCP 9400-FEOL 6” Etcher Mr. Chu 7554 E01-A E01-B E01-C E01-D E01-E E01-F B2
E07 Mattson ASPEN Asher Mr. Chiu 7569 E07-A E07-B E07-C E07-D E07-E E07-F B1
E08 TCP9600-BEOL 6” Etcher Mr. Chu 7554 E08-A E08-B E08-C E08-D E08-E E08-F B2
E09 ICP Etcher Mr. Hsu 7651 E09-A E09-B E09-C E09-D E09-E E09-F B3
E10 LAM2300-FEOL 8” Etcher Mr. Tuan 7521 E10-A E10-B E10-C E10-D E10-E E10-F B3
E11 LAM2300-BEOL 8” Etcher Mr. Tuan 7521 E11-A E11-B E11-C E11-D E11-E E11-F B3
E13 AMAT ALE Mr. Hsu 7651 E13-A E13-B E13-C E13-D -- -- B4
E14 P-17 Surface Profiler Mr. Chu 7554 E14-A E14-B E14-C E14-D E14-E E14-F B2
E15 IBE Mr. Hsu 7651 E15-A E15-B E15-C E15-D     B4
E16 SAMCO Low Damage GaN Etcher Mr. Hsu 7537 E16-A E16-B E16-C E16-D     B4
M11 Laser Marker Ms. Liu 7661 M11-A M11-B M11-C M11-D M11-E M11-F B4
M26 TXRF Ms. Liu 7661 M26-A M26-B M26-C M26-D M26-E -- B4
RDT004 Rapid Thermal Annealing Mr. Niu 7790 RDT004-A RDT004-B RDT004-C RDT004-D RDT004-E -- B2
RDT007 SYSKEY ALD Mr. Hsieh 7520 RDT007-A -- RDT007-C RDT007-D RDT007-E RDT007-F B4
S06 Implantation (Medium Current) Mr. Wu 7698 S06-A S06-B S06-C S06-D S06-E S06-F B4
S08 GaN RTA Mr. Liao 7698 S08-A S08-B S08-C S08-D S08-E S08-F B2
S09 PIII Mr. Liao 7583 S09-A S09-B S09-C S09-D     B4
T03 Horizontal Furnace Ms. Liu 7661 T03-A T03-B T03-C T03-D T03-E T03-F B2
T13 Vertical Furnace Mr. Wu 7698 T13-A T13-B T13-C T13-D T13-E T13-F B3
T17 Backend Vacuum Anneal Furnace Mr. Wu 7698 T17-A T17-B T17-C T17-D T17-E T17-F B2
T19 Oxford PECVD Mr. Jhou 7539 T19-A T19-B T19-C T19-D T19-E T19-F B2
T21 E-gun System Mr. Hsu 7537 T21-A T21-B T21-C T21-D T21-E T21-F B2
T23 FSE Cluster PVD Mr. Wang 7549 T23-A T23-B T23-C T23-D T23-E -- B4
T25 WCVD Mr. Jhou 7539 T25-A T25-B T25-C T25-D T25-E T25-F B2
T26 PECVD Mr. Chu 7554 T26-A T26-B T26-C T26-D T26-E T26-F B2
T28 HDPCVD Mr. Jhou 7539 T28-A T28-B T28-C T28-D T28-E T28-F B2
T29 8” PVD Mr. Yang 7763 T29-A T29-B T29-C T29-D T29-E T29-F B2
T31 12” PVD Mr. Yang 7763 T31-A T31-B T31-C T31-D T31-E T31-F B4
T32 VEECO ALD Mr. Lu 7510 T32-A T32-B T32-C T32-D     B4
T33 MOCVD Mr. Hsu 7587 T33-A T33-B T33-C T33-D     B4
T34 Metal ALD Mr. Chiu 7569 T34-A T34-B T34-C T34-D     B4



Equipment of Device Technology

No. Equipment Contact Ext. Introduction Technical Data Standard Procedures Precautions Operation Standards Assessment Guidelines Open Grade
RDT003 Low Temperature Microwave Annealing System Mr. Sung 7672 RDT003-A RDT003-B RDT003-C RDT003-D -- -- B4
RDT005 Group IV Materials Epitaxy Tool Mr. Luo 7660 RDT005-A RDT005-B RDT005-C RDT005-D RDT005-E -- B4
RDT010 8” Bonder Mr. Sung 7672 RDT010-A RDT010-B RDT010-C RDT010-D -- -- B4
S07 Laser Processing System Mr. Wen 7670 S07-A S07-B S07-C S07-D -- -- B4