Flexible Substrate Structure, Flexible Transistor Structure, and Manufacturing Process Thereof
Technology description：
A flexible substrate structure is provided, which comprises a flexible substrate; a first dielectric layer disposed on the flexible substrate; a metal-containing layer with a reflective rate of over 15% and a heat transfer coefficient of more than 2W/mK; and a second dielectric layer. The metal-containing layer is disposed between the first dielectric layer and the second dielectric layer. The present invention also provides a flexible transistor with the above flexible substrate structure, as well as a manufacturing method thereof.
Vendor qualifications:
Companies with the capability to design or manufacture display panels (organic light-emitting diodes, LCDs or drive circuits) or experience in the development of relevant products.
Application method:
Vendors that are interested may fill out the attached application form and provide photocopies of the following documents. They must send the form and photocopies to the TSRI’s contact as qualification review information by registered mail prior to the application deadline (the 20th day from the date of announcement).
Required photocopies:
- Photocopy of the certification of registration or incorporation
- Photocopy of the most recent business tax or profit-seeking enterprise income tax payment receipt
- Photocopy of the income statement and balance sheet for the most recent three years that have been CPA-audited
Contact:
Mr. Lo 03-5773693 ext. 7635
E-mail: cglo@niar.org.tw
E-mail: cglo@niar.org.tw