Monolithic 3D Integrated Circuit Technology

Research Description
Low-thermal-budget FinFET-based 3D integrated circuit without through-silicon via (TSV).Research Focuses
- Increase of circuit data transmission speed
- High bandwidth
- Low power and IC area reduction
R&D Results
- Integrated multifunction circuits into a single substrate to reduce area and increase data transmission speed.
- Provided domestic R&D teams with a flexible R&D environment that is up to industrial standards to facilitate research and development of advanced circuits.