R&D

Research description

Develop key technology for intelligent electronic systems and applications.

Research focuses.

• Intelligent sensing system platform and applications.
• Edge AI platform and systems.
• Rugged sensing system platform for disaster prevention.
• AIoT platform and systems.

Research results

Develop MorSensor/iSOMA/PaS/SenCu intelligent sensing system platform and smart feed drive systems to provide advanced circuit design and system integration support and services for domestic academic and research teams; both academic achievements and patented technology transfer are taken into consideration.

Develop a rugged sensor system and actually install it on the four major bridges in the Zhuoshui River basin in Taiwan.

Research description

Electromagnetic compatibility of integrated circuits (IC-EMC) measurement technology and design strategy.

Research focuses

• Measurement technology for IEC-61967 and IEC-62132 standards.
• Development of wideband IC-EMC measurement technology.
• Chip-level countermeasure reference designs and IC turnkey design flow.

Research results

Construct measurement technology complied with the IEC standards and EMC countermeasure reference designs.

Assist the partners in industry, academia , and government to develop related technology of IC-EMC.

Wideband conducted EMC measurement technology: IEC 61967-4 up to 13 GHz, IEC 62132-4 up to 18 GHz.

Research description

Millimeter-wave antenna-in-package (mmWave AiP) array research.

Research focuses

• Development of mmWave passive device and AiP technology.
• Development of IPD process technology.
• Antenna array design and simulation.

Research results

Develop antenna array design prototype suitable for millimeter wave bands.

Jointly create mass-producible AiP array systems with the industry.

Research description

Technology development for the combo sensor and readout circuit platform.

Research focuses

• Heterogeneous platform development and creation of design platform environment.
• Multi-sensor component and readout circuit simulation/design/verification/measurement.
• Development of sensor IP rights.
• Development of transducer intellectual property (IP).

Research results

• Tri-axis accelerator sensing system-on-chip (SoC).
• Self-developed chip-scale heterogeneous packaging technology.
• Provide one-stop workflow of the combo senor SoC design and production platform for domestic R&D teams.

Research description

Sensor system circuit with low-power, low-noise, and auto-correct capabilities.

Research focuses

Low-power, low-noise, and auto-calibration sensor interface and readout circuit IP.

Sensor system IP integration platform.

Research results

Successfully integrate accelerometer sensor and circuit system on a chip, and calibrate the sensor with the algorithm in the chip. It is currently the most highly integrated and smallest size monolithic accelerometer in the world.

Research description

Self-powered wireless communication sensor chip.

Research focuses

• Miniaturized variety sensor module.
• Wireless energy harvesting, no battery power required.

Research results

Successfully integrate different process circuit chips, sensors, and micro-coil IPD chip to make a miniaturized sensor module.