Introduce the process design kits of wafer foundry OEM and wafer/multi-project chip implementation service according to academic needs, in order to provide chip tape-out service for the academia.
TSRI provides a number of high voltage/high current chip process, design environment, power MOS and ESD I/O IPs. Besides, TSRI offers the chip implementation courses to introduce the process and IP usage. It assists the academia in accelerating the green-energy and high-power application circuit designs, reducing R&D timeline and learning curve, and providing the SoC solution on the power application chip modules.
PCB fabrication service is provided to extend the chip service and support users' chip system design and testing needs.